Case Study

21 07, 2021

Quality AI Inspection of Blister Packaging

2022-01-10T12:49:45+08:00

AI detection of reflective packaging  Blister packaging for tablets and capsules Blister packaging or push-through-package (PTP) is commonly used for storing tablets and capsules to ensure they remain moisture-proof, [...]

Quality AI Inspection of Blister Packaging2022-01-10T12:49:45+08:00
16 07, 2021

Quality AI Inspection of Beverage Packaging

2022-01-10T12:50:41+08:00

Character recognition on aluminum bottles with AI Printed packaging information and food traceability Production information, storage dates, and batch codes are standardized data that manufacturers are required to disclose [...]

Quality AI Inspection of Beverage Packaging2022-01-10T12:50:41+08:00
15 07, 2021

Inspecting Ball Grid Array (BCA) Soldering Defects

2021-07-26T19:06:11+08:00

AI enabled x-ray feature detection Economical and reliable chip packaging Ball grid array (BGA) technology is a popular packaging method for advanced semiconductor chips that was initially introduced to [...]

Inspecting Ball Grid Array (BCA) Soldering Defects2021-07-26T19:06:11+08:00
15 07, 2021

AI Inspection of Semiconductor Carrier Trays

2021-08-11T10:15:13+08:00

Detecting missing or incorrectly placed chips in trays Carrier trays and the final stage of packaging After inspection and singulation processes, semiconductor trays move chips to chip pockets for [...]

AI Inspection of Semiconductor Carrier Trays2021-08-11T10:15:13+08:00
15 07, 2021

Inspecting Packaged Semiconductor Chips

2021-07-26T18:59:46+08:00

AI unsupervised learning for detecting micro defects External protection layer and packaging processes Cutting processes affect the quality of semiconductor wafers. Occasionally, defects such as surface cracks occur when [...]

Inspecting Packaged Semiconductor Chips2021-07-26T18:59:46+08:00
15 07, 2021

Detecting Chipping Defects in Wafer Dicing

2021-08-11T10:18:46+08:00

Quality control of semiconductor die with AI Reducing semiconductor wafer size Wafer sawing helps singulate the wafer into individual die for subsequent processing. As modern electronics require thinner, smaller, [...]

Detecting Chipping Defects in Wafer Dicing2021-08-11T10:18:46+08:00