AI detection of reflective packaging Blister packaging for tablets and capsules Blister packaging or push-through-package (PTP) is commonly used for storing tablets and capsules to ensure they remain moisture-proof, [...]
Detecting sequencing of coffee capsules with AI Variety of coffee capsules Capsule coffee machines are a growing trend in recent years. Assortments of coffee beans are offered in disposable [...]
Inspecting similar coins with AI deep learning Making transactions easy Coins were first introduced as a method of payment in the ancient times and have since become integral to [...]
Character recognition on aluminum bottles with AI Printed packaging information and food traceability Production information, storage dates, and batch codes are standardized data that manufacturers are required to disclose [...]
AI enabled x-ray feature detection Economical and reliable chip packaging Ball grid array (BGA) technology is a popular packaging method for advanced semiconductor chips that was initially introduced to [...]
Automated detection of cracked eggshells with AI Eggshell and egg quality Chicken eggs are among the most nutritious and popular foods. However, even with thorough cooking, cracked eggs are [...]
Detecting missing or incorrectly placed chips in trays Carrier trays and the final stage of packaging After inspection and singulation processes, semiconductor trays move chips to chip pockets for [...]
AI unsupervised learning for detecting micro defects External protection layer and packaging processes Cutting processes affect the quality of semiconductor wafers. Occasionally, defects such as surface cracks occur when [...]
Quality control of semiconductor die with AI Reducing semiconductor wafer size Wafer sawing helps singulate the wafer into individual die for subsequent processing. As modern electronics require thinner, smaller, [...]
AI inspection of dicing blade defects Quality of wafer dicing blades and tools The rapid development of modern electronic products has intensified the demand and quality requirements for semiconductor [...]
