Solomon Unveils “Full-Wafer Warpage Detection Inside
FOUP/Cassette” at SEMICON Taiwan 2026, Comprehensively
Upgrading Smart Safety in Fab Operations
TAIPEI, TAIWAN – Solomon is redefining the future of semiconductor manufacturing with its powerful advanced optical technologies and comprehensive fab protection solutions at 2026 SEMICON Taiwan. For the first time, Solomon is showcasing the “Full-Wafer Warpage Detection Inside FOUP/Cassette,” which can evaluate the entire wafer profile in real-time during the inspection phase, effectively preventing the risks of wafer collision and tool downtime during the manufacturing process. Concurrently, Solomon is also focusing on the groundbreaking TGV Hole Diameter Defect Inspection technology, fully dedicated to ensuring the yield and quality of next-generation advanced packaging.
Leading Advanced Optical Technology: Precisely Solving Pain Points in FOUP Wafer Warpage and TGV Inspection
Echoing the industry’s strong demand for Physical AI,Solomon is demonstrating the seamlessly integration of AI visual intelligence and advanced optical technology. Solomon states that through top-tier automation integration capabilities, advanced vision technology will be transformed into stable productivity, providing the semiconductor manufacturing industry with a complete automation upgrade path from “perception and judgment to execution,” effectively addressing current industry challenges such as labor shortages and high process complexity.
In terms of key technology layout, this exhibition marks the debut of the “Full-Wafer Warpage Detection Inside FOUP/Cassette”. This demo shows a non-contact optical system that can evaluate the entire wafer profile while the wafer remains inside a FOUP or cassette. Unlike conventional wafer mapping or protrusion sensors that mainly observe the front portion of the wafer, the system uses side-directed optical sensing to detect wafer bow, tilt, or displacement before the robot end-effector enters the carrier, helping prevent wafer collision, breakage, contamination, and tool downtime. In addition, addressing the strong demand for advanced packaging and heterogeneous integration, Solomon introduces the TGV Hole Diameter Defect Inspection solution. Combining AI vision and AOI (Automated Optical Inspection) technologies for TGV hole defect screening and diameter measurement, enabling rapid identification of defects such as unthrough holes and abnormal hole diameters, thereby improving inspection efficiency and quality consistency.
Revolutionizing Fab Operations: Edge AI-Driven Solomon AMM for Intelligent Equipment Anomaly Detection
Another major highlight of this exhibition is the breakthrough integration of Edge AI and external camera perception, redefining how autonomous systems operate in high-tech semiconductor fabs. To meet the critical needs of human-machine collaboration in complex production lines, Solomon presents the Solomon AMM smart equipment anomaly detection technology. Solomon AMM and the SolRobo platform integrate AI machine vision, autonomous mobile robots, and robotic arms, which can autonomously navigate to designated equipment to perform inspections, instantly completing meter reading, indicator light interpretation, object recognition, and equipment anomaly detection, while presenting digital twin applications through SolSim. More importantly, this system features extremely high deployment flexibility, requiring enterprises to make no significant changes to their existing environmental configurations. Under the premise of not affecting continuous capacity and production efficiency, this technology significantly alleviates the burden of traditional manual inspections and effectively reduces the risk of human error, comprehensively upgrading fab safety and management efficiency.
Partnering with Rockwell Solutions to Establish Smart Safety for Semiconductor Manufacturing
In addition to its self-developed vision technology, the exhibition will also simultaneously present the in-depth application results of Solomon and Rockwell solutions. Targeting the semiconductor process and smart safety domains, Solomon introduces top-tier automation control systems from international giants to not only ensure the stable productivity of high-tech fabs but also establish a solid smart safety protection network for semiconductor processes, ensuring every step of the process meets the highest safety standards.
We sincerely invite industry professionals and media friends to visit the Solomon booth at SEMICON Taiwan 2026 to experience firsthand how AI visual intelligence and top-tier automation integration can bring revolutionary breakthroughs and infinite possibilities for production line efficiency to the semiconductor industry.
Exhibition Details:
- Date: Wednesday, September 2, 2026 – Friday, September 4, 2026
- Venue: Taipei Nangang Exhibition Center, Hall 2, 1Floor
- Booth Number: Q5437
