Small, spiral-surfaced metal parts can be inspected using SolVision’s Instance Segmentation tool to learn the different types of cut marks or collision faults from sample images, then building an AI model to recognize these subtle defects.
Excessive adhesive may remain on the chip or overflow on the circuit board and cause the chip to tilt, affecting stability of the whole semiconductor package.
Faulty wafers also usually have subtle defects randomly scattered on the surface, and this prevents AOI systems from setting rules for efficient inspections.
