Faulty wafers also usually have subtle defects randomly scattered on the surface, and this prevents AOI systems from setting rules for efficient inspections.
Excessive adhesive may remain on the chip or overflow on the circuit board and cause the chip to tilt, affecting stability of the whole semiconductor package.
SMT is a critical soldering process in the electronics industry. SolVision detects defects on PCBs which are known to have numerous small, complex components