SolVision’s deep learning facilitates the recognition of varying colored liquids and sedimentation levels for accurate classification and quality control.
Overcoming traditional AOI limitations, Solomon’s SolVision quickly performs OCR without being affected by background or lighting conditions, complexity, or appearance of the serial number.
Inspect small spiral-surfaced metals with SolVision AI for precise defect detection, identifying cut marks, collision faults, and subtle surface flaws.
Excessive adhesive may remain on the chip or overflow on the circuit board and cause the chip to tilt, affecting stability of the whole semiconductor package.
Faulty wafers also usually have subtle defects randomly scattered on the surface, and this prevents AOI systems from setting rules for efficient inspections.