Applications

  • Quality Control of Wafer Dicing

    Using SolVision’s Instance Segmentation tool, irregular lines and multi-drilling defects are labeled in sample images to train the AI model.

  • a group of square objects

    Detecting Chipping Defects in Wafer Dicing

    The location, size and shape of cracks vary each time, and traditional optical inspection cannot accurately identify such unpredictable defects.

  • Inspecting Packaged Semiconductor Chips

    The Anomaly Detection tool uses deep learning technology to teach the AI model sample images of “perfect” wafers.

  • AI Detection of Welding Defects

    Powered by AI, Solomon SolVision can automate welding inspection processes by learning the different shapes and features of weld beads from sample images.