Streamlined LED visual inspection with AI SolVision features an Instance Segmentation tool designed to identify various mini LED defects through image processing.
SolVision enables visual inspection through AI image analysis, strengthening the reliability of displacement and angle information to recognize defective products and errors in the die bonding process.
The optimization dilemma: a large number of defects Hard drive metal bases are vulnerable to many defects during production, from damages to the metal surface to incorrect shape or size.
Faulty wafers also usually have subtle defects randomly scattered on the surface, and this prevents AOI systems from setting rules for efficient inspections.
Excessive adhesive may remain on the chip or overflow on the circuit board and cause the chip to tilt, affecting stability of the whole semiconductor package.