SolVision

As semiconductor manufacturing becomes more sophisticated, the process of creating lead frames needs to improve in accuracy and yield.

Excessive adhesive may remain on the chip or overflow on the circuit board and cause the chip to tilt, affecting stability of the whole semiconductor package.

Faulty wafers also usually have subtle defects randomly scattered on the surface, and this prevents AOI systems from setting rules for efficient inspections.

AI model can accurately identify errors in cable connections and eliminate substandard products in real time.

Powered by AI, SolVision deep learning software trains an AI model by simulating potential weld bead defects in random brightness conditions.

SolVision enables visual inspection through AI image analysis, strengthening the reliability of displacement and angle information to recognize defective products and errors in the die bonding process.

There are many types of defects that may appear differently each time on the stamped parts, in particular oil or water stains, which are not easily detected.

Streamlined LED visual inspection with AI SolVision features an Instance Segmentation tool designed to identify various mini LED defects through image processing.

With AI-based SolVision, production imperfections on club heads can be detected no matter their size, appearance, or location.