AI inspection of dicing blade defects
Quality of wafer dicing blades and tools
The rapid development of modern electronic products has intensified the demand and quality requirements for semiconductor chips. Advancements in manufacturing technology have also made silicon wafers become lighter, thinner and shorter. In order to achieve high yield and optimize production throughput, wafer dicing and singulation techniques are an important aspect to monitor, and the key to dicing quality lies in the blade used and its control.